GB/T 31353-2014
ActiveTest methods for bow of sapphire substrates
蓝宝石衬底片弯曲度测试方法
Application Summary AI generated
This standard specifies the test methods for measuring the bow (warpage) of sapphire substrates, which are thin, disc-shaped wafers used primarily in the manufacturing of LED chips and other optoelectronic devices. It is applied in the metallurgy and semiconductor materials industries to ensure substrate flatness meets quality requirements for subsequent epitaxial growth and device fabrication processes. The standard provides a consistent testing protocol for manufacturers and quality control laboratories to evaluate substrate deformation under specified conditions.
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